Silicon wafer back grinding wheel

Back Grinding Wheel for Surface Grinding Various Silicon Wafer

Application: back thinning, front grinding and fine grinding of discrete devices, integrated circuit substrate silicon wafers, sapphire epitaxial wafers, silicon wafers, arsenide, GaN wafers, silicon-based chips, etc

Grinding Machines: NTS, SHUWA, ENGIS, Okamoto , Disco, TSK and STRASBAUGH, etc

Bonded: Vitrified bond & Resin bond

Diameter: 200mm, 250mm, 280mm, 300mm,  350mm

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Why use vitrified bond for grinding wheels?

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