Silicon wafer back grinding wheel

Back Grinding Wheel for Surface Grinding Various Silicon Wafer

Application: back thinning, front grinding and fine grinding of discrete devices, integrated circuit substrate silicon wafers, sapphire epitaxial wafers, silicon wafers, arsenide, GaN wafers, silicon-based chips, etc

Grinding Machines: NTS, SHUWA, ENGIS, Okamoto , Disco, TSK and STRASBAUGH, etc

Bonded: Vitrified bond & Resin bond

Diameter: 200mm, 250mm, 280mm, 300mm,  350mm

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Why use vitrified bond for grinding wheels?

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Compared with resin grinding, vitrified bond diamond grinding wheels have the following advantages: (1) The grinding efficiency of vitrified grinding wheels is high. (2) Large feeds can be used for vitrified grinding wheels. When the feed rate exceeds a certain amount, the resin grinding wheel will not be able to grind. (3) The vitrified bond diamond abrasive tool hardly needs to be trimmed when grinding, and the resin abrasive tool needs to be trimmed once in a period of time. (4) due to vitrified The shape retention of the grinding wheel is good, so the grinding accuracy is higher than that of the resin grinding wheel, so it has become the first choice for precision and ultra-precision machining. Contact: Miss. Anna Mobile/What's App:+86 15617785923 Skype:Annawng   WeChat: 15617785923 E- mail: A nna.wang@moresuperhard.com www.moresuperhard.com www.pcdgrinding.cn www.morediamondwheel.com www.mogrinding.com www.morecuttingtools.com www.moresuperhard.cn  
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How to make the abrasive tools that have been made soft down?

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How to make the abrasive tools that have been made soft down? The ceramic bond abrasive is immersed in a sodium hydroxide or potassium hydroxide solution, heated to the boiling point, and the concentration of the alkali solution and the boiling time are controlled to appropriately reduce the hardness of the abrasive. Refer to Table 1 for the compatible concentration boiling time. Table 1    Alkali treatment to reduce the hardness of the abrasive reference table Abrasive Grit Boiling time （ h ） Original hardness of abrasive tool K L M N P Q R S T Y Alkaline concentration （ % ） 10 20 30 10 20 30 10 20 30 40 24# 124 123 234 234 113 123 223 123 234 345 235 46# 124 234 345 356 134 234 245 112 123 234 123 60# 124 123 234 346 123 234 235 112 123 233 133 The strength of the grinding wheel after the treatment will be reduced. Therefore, it must...
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How to determine the hardness of ceramic bonded diamond grinding compound sheet?

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How to determine the hardness of ceramic bonded diamond wheel grinding compound sheet? Wheel hardness refers to the external force of the grinding wheel surface particles from the grinding wheel surface is easy to fall off, binder control grinding ability and abrasive hardness has no relationship with the binder strength refers to the hardness of the grinding wheel.                                     www.moresuperhard.com                                     Email:Anna.wang@moresuperhard.com                                     Whatsapp:+8615617785923
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