四轴磨刀砂轮
Resin Diamond wheel for 4-axis Tool resharpening Machine
博文
Silicon wafer back grinding wheel
Back Grinding Wheel for Surface Grinding Various Silicon Wafer Application : back thinning, front grinding and fine grinding of discrete devices, integrated circuit substrate silicon wafers, sapphire epitaxial wafers, silicon wafers, arsenide, GaN wafers, silicon-based chips, etc Grinding Machines : NTS, SHUWA, ENGIS, Okamoto , Disco, TSK and STRASBAUGH, etc Bonded : Vitrified bond & Resin bond Diameter : 200mm, 250mm, 280mm, 300mm, 350mm