Silicon Wafer Back Grinding Wheel



DIAMOND BACKGRINDING WHEELS,Used on backgrinding machines for thinning and flattening silicon wafers, glass products, ceramic products. Sizes range from 8” to 14” O.D. Used on machines manufactured by Disco, Okamoto, Strasbaugh, and many others.

www.moresuperhard.com

WhatsApp:+8615617785923

Anna.wang@moresuperhard.com

评论

此博客中的热门博文

Why use vitrified bond for grinding wheels?

How to make the abrasive tools that have been made soft down?

How to determine the hardness of ceramic bonded diamond grinding compound sheet?